TECHNET Archives

October 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Louis, Edwin @ CSE" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Oct 2001 10:17:27 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (86 lines)
Why do you prefer immersion Silver over immersion Tin?

-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Wednesday, October 03, 2001 7:07 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG v Immersion Ag


Be aware that the wetting forces are lower and wetting too is slower on ENIG
than with HASL or Immersion Silver, or for that matter bare copper. This is
because you are soldering to nickle, not copper. Make sure that the time
above liquidus is long enough and the that temperature under the BGA is hot
enough. You should be able to solder  to the ENIG.
Our experience with Immersion Silver has been positive. I prefer it over
Immersion Tin.

But I do not have data to answer your other questions.
Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kirsch, Clif
Sent: Tuesday, October 02, 2001 4:45 PM
To: [log in to unmask]
Subject: [TN] ENIG v Immersion Ag


We are running into solderability issues with ENIG boards, especially under
dense (500+ pins) BGA devices. Once the BGA is removed some of the pads
indicate they did not / will not wet.

Does anyone have experience with immersion silver finished boards from a
reliability and NEBS compliant standpoint? Also are there surface resistance
issues for test pads that are not reflowed with solder?

Clif Kirsch
Mfg Eng

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2