Don't mean to intefere with you and George but I forgot to add that if the
all the balls do not reflow completely, you can be pulling reflowed balls
thus destroying a good solder joint. That seems out the window now.

I had a black pad photo placed on Steve's site some time ago. Happy to do it
again. With this actuality, no possibility of solder wetting is possiblt.
There are tremendous volumes of information concerning it on this site and
throughout industry. Found my first instance three years ago at HP. Did
plating removal to get to bare copper again, then HASL'd the boards to save
about three hundred or so. Have run into black pad three or four times since
then all with highly qualified board houses. It's a fab nickel plating issue
not, anymore, that difficult to resolve.

MoonMan

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