Guenter,

As I probably will never visit your area of the world again, I have no
reason to "suck up." No matter, you serve us well so the compliment stands.
However, I still need to know how we can get around this issue of having to
either leave solder during rework, after device removal, and, if we do, how
we are expected to remove the IMC layer underneath to effect acceptable
solder joints.

Earl

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