Gents,
If you are using a SmartSonic Ultrasonic cleaner, their technical people say
that because they alternate their ultrasonic frequency, damage to die bonds
should not occur.
You might want to give your Ultrasonic cleaner representitive a call to find
out more specifics.
Steve A
> -----Original Message-----
> From: Guy Ramsey [SMTP:[log in to unmask]]
> Sent: Friday,October 26,2001 12:15 PM
> To: [log in to unmask]
> Subject: Re: [TN] Cleaning paste when misaligned.
>
> I don't mean to cause any undue concern. The issue is fairly simple . . .
> You can break glass and ceramic with sound but it is not likely if you are
> careful. But ultrasonic cleaning can break wire bonds, and wires, this is
> especially true in controls, ceramic ICs and the like were the wires are
> not encapsulated and subject to vibration. There are technologies that are
> effective in reducing this type of damage. Hope this relieves your fear.
> If you are still concerned then you have some homework to do. What
> frequency and power does you cleaner work at. What is a construction of
> the packages in question . . . stuff like that.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Howard Watson
> Sent: Friday, October 26, 2001 11:46 AM
> To: [log in to unmask]
> Subject: Re: [TN] Cleaning paste when misaligned.
>
>
>
> Mike and Guy,
>
> We routinely clean the second side of misprint solder paste, but
> from what you are saying perhaps there could be a problem with damaging
> some components. The components that we clean in the ultrasonic cleaner
> are mostly flat chip package, C lead diodes, and some SOT-23 and SOIC.
> How do I verify which components can or cannot go in the cleaner? Is
> there any test data out there to support this issue? Though we clean very
> few misprints, I am a little concerned. Thanks for your help!
>
> Howard Watson
> Manufacturing Engineer
> AMETEK/Dixson
>
>
>
> "Barmuta, Mike" <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
>
> 10/26/01 09:02 AM
> Please respond to "TechNet E-Mail Forum."
>
>
>
> To: [log in to unmask]
> cc:
> Subject: Re: [TN] Cleaning paste when mis-aligned.
>
>
>
> Cathy: This should not be a problem for the bare (unloaded) PCB.
> However if
> you are doing a double sided reflow and misprint the second side
> you need
> to verify that the first side components are compatible with the
> ultrasonics
> you are using.
>
>
> Regards
>
> Michael Barmuta
>
> Staff Engineer
>
> Fluke Corp.
>
> Everett WA
>
> 425-446-6076
>
> -----Original Message-----
> From: Cathy Killen [mailto:[log in to unmask]]
> Sent: Friday, October 26, 2001 7:30 AM
> To: [log in to unmask]
> Subject: [TN] Cleaning paste when mis-aligned.
> Importance: High
>
>
> Hello All & the mountain dew man.
> Can a mis-printed PCB be washed in a ultrasonic bath to remove all
> paste
> particles?
> Is there any danger of damaging innerlayers of PCB?
>
> Thanks in advance.
>
> Cathy Killen
> Training Instructor
> Smtek Europe Ltd.
> The information contained in the E-mail is confidential. It is
> intended only
> for the stated addressee(s) and access to it by any other person is
> unauthorised.
> The views expressed in this E-mail are those of the author, and do
> not
> represent the views of Smtek Europe, its associates or subsidiaries,
> unless
> otherwise expressly indicated.
> Please note: It is your responsibility to scan this E-mail for
> viruses.
>
>
> --------------------------------------------------------------------------
> --
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message:
> SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
>
> --------------------------------------------------------------------------
> --
> -----
>
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message:
> SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
>
> --------------------------------------------------------------------------
> -------
>
>
>
>
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
