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Subject:	Re: Adjusting the alloy composition in the solderpot
From:	David Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 26 Oct 2001 07:34:00 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

Hi Phil! The latest and greatest information on tin whiskering phenomena
was given by Mike Toben and Rob Schetty at the IPC Fall meeting in Orlando.
Their presentations are contained in the Conference proceedings. Also check
out this paper:

http://download.lead-free.org/downloads/Baudry_STMicro_FIB_LeadFree_Plating_Analysis.pdf

The researchers used  Focused Ion Beam (FIB) microscopy to get a view of the "root" of a whisker (after seeing
the pictures I now know what I want for Xmas!). The FIB paper correlates very well with the Toben/Schetty presentations - we
might be finally getting close to understanding the cause of tin whiskering.


Dave Hillman
Rockwell Collins
[log in to unmask]




"Crepeau, Phil" <[log in to unmask]>@ipc.org> on 10/25/2001 06:25:52 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  Re: [TN] Adjusting the alloy composition in the solderpot


hi,

does reflowed tin grow whiskers?  i thought whiskers grew from plated tin
that's under stress.  i also thought that one way to correct this was to
reflow the plated tin.

phil

-----Original Message-----
From: Bogert [mailto:[log in to unmask]]
Sent: Thursday, October 25, 2001 3:13 PM
To: [log in to unmask]
Subject: Re: [TN] Adjusting the alloy composition in the solderpot


Wrong.  Pure tin will grow tin whiskers.

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