Guy,
I am a bit concerned about your suggestion about not baking the BGA's
without knowing what their exposure time is. If they haven't been
monitored, or have been out of a dry cabinet for 16 hours or more in total
since previous bake or since removal from their original barrier bags, it's
safer to bake them after re-balling them. This is to minimise the risk of
delamination or popcorning when they placed back on the boards and
subjected to reflow.
I think you're right that both J-STD-20 and J-STD-33 are free downloads
from the IPC site.
Peter Duncan
Guy Ramsey
<gramsey@ACIU To: [log in to unmask]
SA.ORG> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
Sent by: Aero/ST Group)
TechNet Subject: Re: [TN] BGA Component Baking -
<[log in to unmask] Plastic Body
ORG>
10/26/01
04:27 AM
Please
respond to
"TechNet
E-Mail
Forum."
We would not bake the parts again, after reballing, sounds like you will be
meeting the requirments of the standard. I think it is a free download. If
you need the link let me know and I will try to find it. Might have been on
the ANSI page or JEDEC.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeff Ferry
> Sent: Thursday, October 25, 2001 9:45 AM
> To: [log in to unmask]
> Subject: [TN] BGA Component Baking - Plastic Body
>
>
> BGA Guru's,
>
> We're doing a big project that requires removal/replacement of several
> hundred plastic BGA components. After removal we'll be reballing the
BGA's
> and then reinstalling them. These are new builds, they're not coming back
> from the field.
>
> Who knows what J-STD-20, or any other reference, says about prebaking
> temp/time to eliminate possible moisture problems in the components or
> boards prior to initial removal? Removed parts will be stored in a
> desiccant chamber before and after reballing. Do we need to bake these
> parts again prior to installation? Do ya'all normally bake new
> build boards
> in this situation?
>
> Thanks for you recommendations.
>
> Jeff Ferry
> CEO
> Circuit Technology Center, Inc.
>
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