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October 2001

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Oct 2001 09:17:50 +0300
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Wrong. There will be no whiskers after it has gone through the wave.

Bogert wrote:
>
> Wrong.  Pure tin will grow tin whiskers.
> ----- Original Message -----
> From: "Brian Ellis" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, October 25, 2001 3:36 AM
> Subject: Re: [TN] Adjusting the alloy composition in the solderpot
>
> > Here's an interesting thought:
> >
> > If we ask all the component manufacturers (incl. bare boards) to use
> > pure tin for their lead coatings etc., instead of tin/lead, this would
> > a) satisfy the lead-free guys
> > b) help keep the proportions right in the solder pot
> >
> > Right?
> >
> > Brian
> >
> > "d. terstegge" wrote:
> > >
> > > Hi Technet,
> > >
> > > I just received an analyses report for our solder bath composition, and
> my Sn level is at 61.5 percent instead of the nominal 63 percent. This is at
> the edge of the J-STD-001C specification, so I'll have to add some pure tin
> to the pot.
> > > Last time was many years ago, and unfortunately I forgot the formula for
> calculating the amount of tin to add.
> > > It can't be that difficult, but I thought it would be quicker to ask.
> > >
> > > Thanks,
> > >
> > > Daan Terstegge
> > > SMT Centre
> > > Thales Communications
> > > Unclassified mail
> > > Personal Website: http://www.smtinfo.net
> > >
> >
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