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October 2001

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Subject:
From:
"Crepeau, Phil" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Oct 2001 16:25:52 -0700
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hi,

does reflowed tin grow whiskers?  i thought whiskers grew from plated tin that's under stress.  i also thought that one way to correct this was to reflow the plated tin.

phil

-----Original Message-----
From: Bogert [mailto:[log in to unmask]]
Sent: Thursday, October 25, 2001 3:13 PM
To: [log in to unmask]
Subject: Re: [TN] Adjusting the alloy composition in the solderpot


Wrong.  Pure tin will grow tin whiskers.
----- Original Message -----
From: "Brian Ellis" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 25, 2001 3:36 AM
Subject: Re: [TN] Adjusting the alloy composition in the solderpot


> Here's an interesting thought:
>
> If we ask all the component manufacturers (incl. bare boards) to use
> pure tin for their lead coatings etc., instead of tin/lead, this would
> a) satisfy the lead-free guys
> b) help keep the proportions right in the solder pot
>
> Right?
>
> Brian
>
> "d. terstegge" wrote:
> >
> > Hi Technet,
> >
> > I just received an analyses report for our solder bath composition, and
my Sn level is at 61.5 percent instead of the nominal 63 percent. This is at
the edge of the J-STD-001C specification, so I'll have to add some pure tin
to the pot.
> > Last time was many years ago, and unfortunately I forgot the formula for
calculating the amount of tin to add.
> > It can't be that difficult, but I thought it would be quicker to ask.
> >
> > Thanks,
> >
> > Daan Terstegge
> > SMT Centre
> > Thales Communications
> > Unclassified mail
> > Personal Website: http://www.smtinfo.net
> >
>
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