Just been talking with someone also much respected in this field. The
following is my response to his answere:

Besides the glass brush talked about in other discussions, my biggest
concerns are about fine pitch and BGA device types and the solder
termination area topography required (flat)to effect placement, continued
alignment, and subsequent reflow and "acceptable" solder joint formation -
not only as first required but for rework.

As you know and have observed many times, once device removal is effected,
the solder left is very uneven, to say the least. This, again as you know,
is why we carefully wick off, or otherwise remove the solder left after the
component removal process.

This, then, is the dilemma as I see it. In your terms, we now expose an IMC
layer after the solder removal process, to whatever extent, preventing
solder "wetting" in some areas not quantifiable. I guess, this is a random
occurrence (where and how much IMC) is left. Therefore, doesn't this point
to sh luck to again effect "acceptable solder joints or is it of no
consequence - for the most part as Wolfgang said.

Earl

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