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October 2001

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Subject:
From:
Jeff Ferry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Oct 2001 08:45:01 -0500
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BGA Guru's,

We're doing a big project that requires removal/replacement of several
hundred plastic BGA components. After removal we'll be reballing the BGA's
and then reinstalling them. These are new builds, they're not coming back
from the field.

Who knows what J-STD-20, or any other reference, says about prebaking
temp/time to eliminate possible moisture problems in the components or
boards prior to initial removal? Removed parts will be stored in a
desiccant chamber before and after reballing. Do we need to bake these
parts again prior to installation? Do ya'all normally bake new build boards
in this situation?

Thanks for you recommendations.

Jeff Ferry
CEO
Circuit Technology Center, Inc.

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