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October 2001

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Oct 2001 09:51:29 -0500
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Hi Daan! You are right - its not that difficult but even a metallurgical
engineer (e.g. me!) can't remember the formula. However, the industry
leaders anticipated just such lapses of memory and have documented the
formula in the JSTD-001 Handbook, page 62 (paragraph 5.3.7).  Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





"d. terstegge" <[log in to unmask]>@ipc.org> on 10/24/2001
09:28:57 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Adjusting the alloy composition in the solderpot


Hi Technet,

I just received an analyses report for our solder bath composition, and my
Sn level is at 61.5 percent instead of the nominal 63 percent. This is at
the edge of the J-STD-001C specification, so I'll have to add some pure tin
to the pot.
Last time was many years ago, and unfortunately I forgot the formula for
calculating the amount of tin to add.
It can't be that difficult, but I thought it would be quicker to ask.

Thanks,

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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