Who knows?  I'd like to think restrained board materials (Thermount?).
There's also "near hermetic" plastic packages.  Or how about  wafer applied
seals in plastic packages (see http://www.waspp.org <http://www.waspp.org>
).

The reason for my questions is that I may have an opportunity to start an
IRAD (R&D) for alternate designs.  Thought this would be a good place to
start.

Jim Marsico



        -----Original Message-----
        From:   Earl Moon [SMTP:[log in to unmask]]
        Sent:   Tuesday, October 02, 2001 2:51 PM
        To:     [log in to unmask]; Jim Marsico
        Subject:        Re: Cu-In-Cu boards

        Jim,

        I'm with you. Your point was made 5x5. Thought you brought out the
best in
        folks including me. I can't offer any advanced thinking at this
time. Where
        do you think this thing, that is and always has bee so important, is
going.

        I'm told I still have down hole LCCC boards still working out in
some dry
        duster. They used only polyimide with no core but were "potted" to
allow
        them to work so long with carefully considered pad parameters and
excellent
        process management techniques. How about considering more compliant
        surfaces, again for the twenty third time?

        MoonMan

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