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October 2001

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Oct 2001 16:32:04 +0100
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Hi Scott,

Don't know the root cause, but I think that the composition of dross is just a little different than the composition of the solder. This took us about 6 years to get to this 61.5 percent Sn level (that's the age of the machine)
I think there were some discussions recently about how the leadtin composition is affected by the boards conductor finishing, and if I remember it well the use of white tin shouldn't result in any problems with the solder pot composition.

Daan

>>> Scott Kauling <[log in to unmask]> 10/24 2:59 pm >>>
Daan

I do not have the formula, sorry. I would lean on your solder supplier to
help you.

Have you determined a root cause for the Sn levels to decrease?  I was
wondering because, we are beginning to use white tin for a final finish.


Scott Kauling

-----Original Message-----
From:   d. terstegge [SMTP:[log in to unmask]] 
Sent:   Wednesday, October 24, 2001 9:29 AM
To:     [log in to unmask] 
Subject:        [TN] Adjusting the alloy composition in the solderpot

Hi Technet,

I just received an analyses report for our solder bath composition, and my
Sn level is at 61.5 percent instead of the nominal 63 percent. This is at
the edge of the J-STD-001C specification, so I'll have to add some pure tin
to the pot.
Last time was many years ago, and unfortunately I forgot the formula for
calculating the amount of tin to add.
It can't be that difficult, but I thought it would be quicker to ask.

Thanks,

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net 

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