Seth,

You said it yourself in the beginning as MCM's have used this technology for
years. The plating overhang issue can be resolved using extra thick or
additional plies of DF photo resist but you'll have a high mound left. Have
pictures of this as well.

I/we did this stuff many years ago as I indicated for through hole boards.
Also did it in the early/mid 90's with early BGA types hoping to eliminate
some processing problems not yet addressable.

I worked with IBM, while working with Cray, a couple of years ago. They used
the technology for then to be 3400 I/O MCM's. Who else is out there doing
this with MCM's and "normal" PCB's? Still, the minimum thickness and
ductility requirements must be in place no matter the overhang issue and its
solution.

MoonMan

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