I would suggest you get a copy of the classic Klein Wassink book 'Soldering
in Electronics' (ISBN 0 901150 24X).
Wave soldering SOICs, I would add extra pads at the trailing end of the IC
connected to the last pads of the IC by fine tracks with no resist on.
Neil
-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: 23 October 2001 17:41
Subject: Re: Land pattern for wave soldering
Hi Steve,
Thanks for the prompt response.
What kind of solder thieves should I put in, say a SOIC08? Do I need to put
in
leading pads and leading pads? Is there any standard published that I can
find
or buy regarding wave soldering issues?
Thanks for the support.
Patrick
Steve Owen <[log in to unmask]> on 10/23/2001 09:03:04 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Patrick Lam/SEL)
Subject: Re: [TN] Land pattern for wave soldering
Hi Patrick,
If you look at say a side one footprint(reflow)for quad flat pack as opposed
to a side two (wavesolder)side. On side two you will ideally need to present
the component @ 45 deg to the wave and have solder thieves in each of the
four corners to eliminate solder bridges.
just an example.
hope its of some use.
-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: 23 October 2001 16:26
To: [log in to unmask]
Subject: [TN] Land pattern for wave soldering
Hi Technetters,
Is there a need to have different SMD land size/ pattern for wave soldering?
Any
suggestion is appreciated.
Thanks,
Patrick
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