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October 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Oct 2001 11:28:19 +0800
Content-Type:
text/plain
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text/plain (82 lines)
Hi, Roger,

ENIG plating can be done either before or after solder masking. If before,
you just get more ENIG plating on the board as no areas will be masked.
This might cost a little more because of the extra chemicals consumed, but
saves the risk of the mask being attacked by the gold plating bath.

If after, the you save on the Nickel/Gold plating but have to have a solder
mask that is capable of withstanding the plating processes, particularly
the Gold one.

Peter Duncan



                    "Roger M. Stoops"
                    <rstoops@SPECTRAPRECISI        To:     [log in to unmask]
                    ONDAY.COM>                     cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by: TechNet               Aero/ST Group)
                    <[log in to unmask]>              Subject:     [TN] Question regarding ENIG and
                                                   solder mask

                    10/23/01 11:52 PM
                    Please respond to
                    "TechNet E-Mail Forum."






For some reason I can't recollect (due to advancing age, dead brain cells,
etc.) whether ENIG plating is done before solder mask or after .  I
remember something about the chemical baths attacking the solder mask, so
all electroless nickel and immersion gold plating would have to be done
first.  Could someone check my memory for me please?

Roger M. Stoops, C.I.D., PCB Designer
[log in to unmask]


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