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October 2001

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Oct 2001 21:06:56 -0700
Content-Type:
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The most cogent discussion of secondary side pads for wave soldering is in
"Manufacturing Techniques For Surface Mounted Assemblies" R. J. Klein
Wassink & M. M. F. Verguld, Electrochemical Publications, 1995, ISBN
0901150304.

We align most SMT devices with the direction of travel as we would align a
similarly leaded PTH component.  The exception is devices with leads on four
sides, such as QFP and PLCC, which are aligned 45° to the wave.

Other points:
* QFP, PLCC, and SOP variants have thief [scavanger] pads trailing the last
pads to see the wave.
* Generally, wave side SMT pads are narrower and have less protrusion from
the component body than primary side pads.

Dave Fish

----- Original Message -----
From: "Patrick Lam" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 23, 2001 8:26 AM
Subject: [TN] Land pattern for wave soldering


> Hi Technetters,
>
> Is there a need to have different SMD land size/ pattern for wave
soldering? Any
> suggestion is appreciated.
>
> Thanks,
> Patrick
>
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