Roger

The good news is you don't have to remember anymore.  With the right
soldermask, you can do it before or after.  We use a mask from Enthone that
is formulated to provide chemical resistance to the ENIG chemistries.
Here's a link to some more information on the issue.

http://www.enthone.com/electronics/pdf/IMUP10.pdf

> ----------
> From:         Roger M. Stoops[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Tuesday, October 23, 2001 8:52 AM
> To:   [log in to unmask]
> Subject:      [TN] Question regarding ENIG and solder mask
>
> For some reason I can't recollect (due to advancing age, dead brain cells,
> etc.) whether ENIG plating is done before solder mask or after .  I
> remember something about the chemical baths attacking the solder mask, so
> all electroless nickel and immersion gold plating would have to be done
> first.  Could someone check my memory for me please?
>
> Roger M. Stoops, C.I.D., PCB Designer
> [log in to unmask]
>
>
> Trimble
> Engineering and Construction Division
> 5475 Kellenburger Rd.
> Dayton, OH 45424-1099 USA
> Ph: +01 937.233.8921 or +01 937.233.4574 ext 288
> Fax: +01 937.233.7511
>
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