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October 2001

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Subject:
From:
Steve Owen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Oct 2001 17:03:04 +0100
Content-Type:
text/plain
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text/plain (58 lines)
Hi Patrick,

If you look at say a side one footprint(reflow)for quad flat pack as opposed
to a side two (wavesolder)side. On side two you will ideally need to present
the component @ 45 deg to the wave and have solder thieves in each of the
four corners to eliminate solder bridges.

just an example.

hope its of some use.

-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: 23 October 2001 16:26
To: [log in to unmask]
Subject: [TN] Land pattern for wave soldering


Hi Technetters,

Is there a need to have different SMD land size/ pattern for wave soldering?
Any
suggestion is appreciated.

Thanks,
Patrick

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