Hoping the collective wisdom of Technet will be able to answer this question
for me.

Have there been any definitive studys done on the reliability and
manufactureablity of landless vias?  I found an abstract posted on ITRI, but
it didn't go into as much detail as I had hoped.  It seems to have been
used, if not quite commonly, on things like MCMs and substrate materials,
but I haven't been able to find too much on "standard" PCBs.  I would've
imagined that this would've already been investigated as a way to free up
real estate on boards wihtout having to go to blind/buried/build up
processes.

If anybody could point me in the right direction, that would be great.

TIA.

Roger Su
Sr. Manufacutring Engineer
L-3 Communications

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