Guenter,

Very clearly stated and appreciated that way. Still, being a stubborn not
very insightful and often ignorant sort, I get some of it but not all.

I realize "wetting" is a function of diffusion and intermetallic formation,
I think. It's the surface thing that still has me going. Werner said, as we
all should understand, that surface scientists know there are a specified
number of atomic layers, measured in Angstroms, composing an objects
surface. If it is 1000, is this the "depth" to which diffusion takes place?
Beyond this, is this fair ground as well, or does Manko's old definition
still hold up?

I know these questions have been answered, just as they have been asked,
before many times, as we all have read and studied. It still bothers me and,
I think, that is fair as soldering, solder, and the process in which metal
SURFACES are joined using, I presume, a uetectic alloy will be questioned
and answered many more times in the future. Simply, I want to get real
comfortable, not as a surface scientist, but as a manufacturing engineering
soldering guy on the floor so I can move to life without lead but,
hopefully, with some other eutectic alloy used to joing "metal" surfaces.

Earl

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