Jon,

What kind of part(s) are you talking about? Chips? Leadless carriers? Leaded
carriers? Resistor/cap nets? BGA's? What is the solder slump of the one
paste vs. the other?

Dorothy Lush

> ----------
> From:         Jonathan A Noquil[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Monday, October 01, 2001 10:14 PM
> To:   [log in to unmask]
> Subject:      Component skewing
>
> Hello Guys,
> I have been experiencing component skewing after reflow.
> However, when i used type 6 paste (no clean flux), there is no skewing
> or movement of the component but a lot of voids.
> When i used type 3 paste, the voids were reduced but there is much skewing
> of the components. Seems voiding and skewing were in contrast.
> Does anybody had experienced the same problem. Had they gotten the
> optimum parameter? (Less voids, no skewing?).
> My process is solder paste dispensing, then attach the component and
> reflow
> in an N2 Blanketed oven.
> Paste is leadfree (alloy : 91.5Sn8.5Sb).
>
> Appreciate any help
>
> God Bless
>
>
> thanks
>
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