Well, yes, this is a MIL program, and you are correct, either one
temperature or the other, not both. The top assembly design incorporates a
housing with microelectronics in a hermetically sealed compartment AND the
SMT assembly in a non-hermetic compartment. The hermetic side is, in fact,
a hybrid which must meet the 883 screening, the SMT assembly just goes along
for the ride. The SMT assembly needs to remain installed so the unit can be
tested during burn-in. I guess Werner answered my question regarding the
effects to the PWB assembly if exposed to these conditions. BTW, the board
will be fabricated with two .010" planes, either CIC or CMC. I don't think
that this would be an issue either.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Misner, Bruce [SMTP:[log in to unmask]]
Sent: Tuesday, October 16, 2001 12:22 PM
To: [log in to unmask]
Subject: Re: [TN] PWB ASSEMBLY BURN-IN TEST
Jim,
Those burn-ins are typical for Military grade microelectronic
devices (one
time and temp or the other, not one followed by the other) per Mil
Std 883.
Could this SMT assembly be for the military and have a number of
flip chip,
COB or chip scale devices that are driving your customer in that
direction?
Could they believe that this is more like a multichip module on
laminate
(MCM-L) rather than an SMT assembly and hence 883 is more
applicable? Your
definition and theirs may differ.
Regards,
Bruce Misner
> ----------
> From: Marsico, James[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.
> Sent: Tuesday, October 16, 2001 7:11 AM
> To: [log in to unmask]
> Subject: [TN] PWB ASSEMBLY BURN-IN TEST
>
> Good day Technet:
> We're being asked to perform a burn-in test (160 HRS @ 125ºC and
352 HRS @
> 100ºC) on a surface mount assembly. I'm sure that the parts can
withstand
> this environment, but what about the PWB and solder joints?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
>
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