Jim,

Those burn-ins are typical for Military grade microelectronic devices (one
time and temp or the other, not one followed by the other) per Mil Std 883.
Could this SMT assembly be for the military and have a number of flip chip,
COB or chip scale devices that are driving your customer in that direction?
Could they believe that this is more like a multichip module on laminate
(MCM-L) rather than an SMT assembly and hence 883 is more applicable? Your
definition and theirs may differ.

Regards,
Bruce Misner

> ----------
> From:         Marsico, James[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Tuesday, October 16, 2001 7:11 AM
> To:   [log in to unmask]
> Subject:      [TN] PWB ASSEMBLY BURN-IN TEST
>
> Good day Technet:
> We're being asked to perform a burn-in test (160 HRS @ 125ºC and 352 HRS @
> 100ºC) on a surface mount assembly.  I'm sure that the parts can withstand
> this environment, but what about the PWB and solder joints?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
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