Hi Jim! Is the intent to use the assemblies in sellable product once the
burn-in testing is complete or is this just a qualification test? I believe
the PWB and solder joints will withstand the testing (provided the
materials are for IPC Class 3 use environments) but you will significantly
reduce the overall product life under these conditions. Werner Engelmaier
has published some great data on how over testing can impact use life.
Those burn-in conditions are pretty rough - any rationale logic behind
them?

Dave Hillman
Rockwell Collins
[log in to unmask]




"Marsico, James" <[log in to unmask]>@ipc.org> on 10/16/2001 06:11:33
AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] PWB ASSEMBLY BURN-IN TEST


Good day Technet:
We're being asked to perform a burn-in test (160 HRS @ 125ºC and 352 HRS @
100ºC) on a surface mount assembly.  I'm sure that the parts can withstand
this environment, but what about the PWB and solder joints?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

---------------------------------------------------------------------------------

Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
---------------------------------------------------------------------------------


---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------