Thank you Phil very much. Your studies and comments are very insightful.

It seems "current" solder joint formation technology, dating back over a
thousand or more years, is very reliable and forgiving under almost any
condition, stress, shock, or operational environment. High or relatively low
purity copper, high or low thickness intermetallic compounds, etc. all seem
to have little affect on solder joints, in general. Once a "good" solder
joint is formed, it seems that it should remain in tact for some time. Will
this be true for our "new age" solder joints - as lead free, depending on
the alloy, or not, for a particular application?

Earl Moon

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