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October 2001

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Subject:
From:
"Crepeau, Phil" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Oct 2001 07:20:31 -0700
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hi,

after some embarrassing delamination (the structural adhesive between the lanxide and the pwb pulled silicon carbide particles out of the lanxide and failed, we went to a polyimide-thermount laminate and bonded the pwb to a straight aluminum core with an arlon silicone adhesive.  i slept a lot better afterward; no adhesive (or solder joint) failures.  on the other hand, if you like living on the edge...

phil

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Tuesday, October 02, 2001 4:09 AM
To: [log in to unmask]
Subject: Re: [TN] Cu-In-Cu boards


Well, we primarily build military electronics with LCCCs, thus the need for
a restrained board. (We're using silicon carbide/aluminum composite cores.)
I've been tasked to look at this design/technology and come up with
alternatives.  I'm interested in alternate restraining core material, board
material, leaded SMT components, near-hermetic plastic components, etc.,
etc.  What are you military guys/gals doing these days?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Earl Moon [SMTP:[log in to unmask]]
        Sent:   Tuesday, October 02, 2001 4:19 AM
        To:     [log in to unmask]; Jim Marsico
        Subject:        Re: Cu-In-Cu boards

        I don't do well at 0200. Maybe you meant thermal-mechamical
stability. If
        so, CIC obviously applies as does Kevlar and Carbon fiber materials.
Diamond
        types are best but anyone up for that?

        I quit, thankfully to us all.

        MoonMan

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