Jim,

I agree with that. This type of testing will not only cause more damage then it "finds" but
it also has a very poor track record for "finding" these intermittent problems. It simply
does not recreate the conditions at the time of failure!

David A. Douthit
Manager
LoCan LLC

"Marsico, James" wrote:

> Hi Bill,
> All these test guys are the same.  I think they issue a heat gun and a can
> of cold spray when they leave school!  They were doing exactly the same
> thing at out facility, until we found out and complained.  Now they claim
> that they don't use this procedure anymore.  I'll bet you can still find
> them in somebody's draw, though.
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
>         -----Original Message-----
>         From:   William Raymond [SMTP:[log in to unmask]]
>         Sent:   Monday, October 08, 2001 8:44 AM
>         To:     [log in to unmask]
>         Subject:        [TN] Hot and cold cycle on BGA's at test and
> repair...
>
>         Hello all...
>
>         I'm in need of some opinions. Our test and repair department
> (functional
>         test) uses a cold spray (from a can) and hot air guns (heat-shrink
> heat
>         guns) to heat and cool BGA devices (plus other IC devices like
> QFP's, etc)
>         to help diagnose boards that fail functional test.  I'm trying to
> make the
>         point that this practice is very risky, especially to BGA type
> devices
>         because of the severe stress applied to the solder ball connections.
> The
>         application of cold spray and/or hot air from a hand held heat gun
> are both
>         VERY uncontrolled processes and should be eliminated from our
> procedures.
>         Would anyone out there be willing to share their views and/or
> experiences
>         with this?
>
>         Thanks in advance,  Bill
>
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