TECHNET Archives

October 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Oct 2001 13:58:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Phil,

So the following is of concern:

:The thickness of the intermetallic formed by thermal aging had little
effect on the peel strength until the intermetallic thickness reached above
25 microns (0.001 inch). Then the lead rich layer appeared to be a major the
contributor, it formed large lead crystals the fractured easily along grain
boundaries."

Is this then a thickness specification not to be exceeded, and how easily
under what conditions did the fracture occur?

Earl

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2