Hi Bill,
All these test guys are the same.  I think they issue a heat gun and a can
of cold spray when they leave school!  They were doing exactly the same
thing at out facility, until we found out and complained.  Now they claim
that they don't use this procedure anymore.  I'll bet you can still find
them in somebody's draw, though.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   William Raymond [SMTP:[log in to unmask]]
        Sent:   Monday, October 08, 2001 8:44 AM
        To:     [log in to unmask]
        Subject:        [TN] Hot and cold cycle on BGA's at test and
repair...

        Hello all...

        I'm in need of some opinions. Our test and repair department
(functional
        test) uses a cold spray (from a can) and hot air guns (heat-shrink
heat
        guns) to heat and cool BGA devices (plus other IC devices like
QFP's, etc)
        to help diagnose boards that fail functional test.  I'm trying to
make the
        point that this practice is very risky, especially to BGA type
devices
        because of the severe stress applied to the solder ball connections.
The
        application of cold spray and/or hot air from a hand held heat gun
are both
        VERY uncontrolled processes and should be eliminated from our
procedures.
        Would anyone out there be willing to share their views and/or
experiences
        with this?

        Thanks in advance,  Bill


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