Sounds like a really bad idea and in 'finding faults' they could also be
creating a few.

It reminds me of watching a man looking for gas pipes underground by
hammering a steel crowbar into the ground...  he found he was very lucky and
sometimes found the gas leak just where he was looking!!

Neil

-----Original Message-----
From: William Raymond [mailto:[log in to unmask]]
Sent: 08 October 2001 13:44
Subject: Hot and cold cycle on BGA's at test and repair...


Hello all...

I'm in need of some opinions. Our test and repair department (functional
test) uses a cold spray (from a can) and hot air guns (heat-shrink heat
guns) to heat and cool BGA devices (plus other IC devices like QFP's, etc)
to help diagnose boards that fail functional test.  I'm trying to make the
point that this practice is very risky, especially to BGA type devices
because of the severe stress applied to the solder ball connections.  The
application of cold spray and/or hot air from a hand held heat gun are both
VERY uncontrolled processes and should be eliminated from our procedures.
Would anyone out there be willing to share their views and/or experiences
with this?

Thanks in advance,  Bill

#####################################################################################
Attention:

This message is for the named person's use only.  It may contain confidential,
proprietary or legally privileged information.  No confidentiality or privilege
is waived or lost by any mistransmission.  If you receive this message in error,
please immediately delete it and all copies of it from your system, destroy any
hard copies of it securely and notify the sender.  You must not, directly or
indirectly, use, disclose, distribute, print, or copy any part of this message
if you are not the intended recipient. STADIUM GROUP PLC and any of its subsidiaries
each reserve the right to monitor all e-mail communications through its networks.
Any views expressed in this message are those of the individual sender, except where
the message states otherwise and the sender is authorised to state them to be the
views of Stadium Group Plc. or one of its subsidiaries.

Although this message has been scanned by MailMarshall for known viruses and
inappropriate content, we recommend that recipients employ appropriate measures on
their systems to intercept any such material.

Thank You - Stadium Group Plc., IT Department - Tel: +44 (0)1429 266544
#####################################################################################

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------