TECHNET Archives

October 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Oct 2001 07:57:27 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (70 lines)
William,

As an old test engineer, I used to use cold spray (freeze mist) to try and verify a component
was defective that seemed to be running hot compared to other components temperature at the
same ref des.  It was usually a focused blast of freeze mist, not a continuous stream and then
only if a component seemed to be functioning and would blow up after some run time and seemed
to be hotter to the touch then other components at that location.  I didn't use freeze mist to
emulate thermal shock by blasting away at a component and certainly not a BGA contact area.

I didn't use heat guns because they are pretty uncontrolled as you state and even if you stuck
thermal couples on tops of the packages, it still is pretty uncontrolled and even if you have
fixtures to focus the heat on the component in question, it still seems like a potential risk
to the other components reliability so why take it.  I have seen people heat up BGAs to see if
opens start to make contact, which probably says you then need to replace or reflow a certain
BGA, but again, the risk to the reliability of other components can present a bigger problem
with component/assy MTBF.

In general, get your test coverage high through good DFM/DFT design and layout and you won't
have to be so creative with heat guns and cold spray.

DT





William Raymond wrote:

> Hello all...
>
> I’m in need of some opinions. Our test and repair department (functional
> test) uses a cold spray (from a can) and hot air guns (heat-shrink heat
> guns) to heat and cool BGA devices (plus other IC devices like QFP’s, etc)
> to help diagnose boards that fail functional test.  I’m trying to make the
> point that this practice is very risky, especially to BGA type devices
> because of the severe stress applied to the solder ball connections.  The
> application of cold spray and/or hot air from a hand held heat gun are both
> VERY uncontrolled processes and should be eliminated from our procedures.
> Would anyone out there be willing to share their views and/or experiences
> with this?
>
> Thanks in advance,  Bill
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------

--
Darrel Therriault
VP, Mfg. Operations
INCEP Technologies, Inc
(858)547-9925 223
[log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2