To Marichu's defense, he has asked the question to the limit of the
available defect description.  To the other replies, you are correct in
asking for more information to answer the question.

Perhaps categorizing poor wetting/insufficient solder/dewetting/non-wetting
in more causal descriptive terms would be useful.  It is the difference
between describing a symptom vs. describing a cause. How and when is
performance affected by these characteristics?  Does it vary by circuit
application?  In other words when are they no longer cosmetic defects?

In terms of inspection performance, the yield of attempting to screen out
any of these characteristics is poor.  It is also futile to measure if
action on controlling solder process inputs is not taken.  If you have
reached the performance limit of the solder process and the defects are
still present - how can the affect on product be assessed?

Steve Shoda
BAE SYSTEMS Controls


-----Original Message-----
From: Marichu S. Amalin [mailto:[log in to unmask]]
Sent: Thursday, October 04, 2001 7:59 PM
To: [log in to unmask]
Subject: [TN] Poor wetting on solder joints


What could be the cause of poor wetting on solder joints and how we can
solve it?

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