Hello all...

I’m in need of some opinions. Our test and repair department (functional
test) uses a cold spray (from a can) and hot air guns (heat-shrink heat
guns) to heat and cool BGA devices (plus other IC devices like QFP’s, etc)
to help diagnose boards that fail functional test.  I’m trying to make the
point that this practice is very risky, especially to BGA type devices
because of the severe stress applied to the solder ball connections.  The
application of cold spray and/or hot air from a hand held heat gun are both
VERY uncontrolled processes and should be eliminated from our procedures.
Would anyone out there be willing to share their views and/or experiences
with this?

Thanks in advance,  Bill

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