Thanks for all the input. I guess the remaining question is should there
be any copper content end up above the IMC layers after reflow? If the
answer is yes, what is the acceptable limit?

Best regards,
M. Yuen

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Sunday, October 07, 2001 10:37 AM
To: [log in to unmask]
Subject: Re: [TN] Copper migration


Maybe more interesting than the original subject, whatever that was, is
from
where are all the extra question marks coming in my last posting???????

Very interesting,

MoonMan

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