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October 2001

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 6 Oct 2001 19:10:08 EDT
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Hi Earl,
I sure do not see it the same way--"My concerns start with HASL as a wasted,
mostly
detrimental process as a major contributor to IMC growth". I have yet to see
a solder joint fail because of 'IMC growth,' with the possible exception of
assemblies that were forgotten in the reflow oven over lunch. I much prefer
to see thick IMC layers than  inadequately wetted soldering pads, and with
HASL, as they say: "Nothing solders to solder like solder."

Werner Engelmaier

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