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October 2001

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Subject:
From:
"Dorothy M. Lush" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Oct 2001 08:51:47 -0700
Content-Type:
text/plain
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text/plain (163 lines)
Gerard,

We got this email recently with a link to a paper about board baking. See if
it will help you.

http://www.isolalaminatesystems.com/technical/techbulletins/index.htm
This is a web site at isola laminates that has a tech paper addressing board
baking.





Steve Abrahamson <[log in to unmask]>@IPC.ORG> on 10/04/2001 09:53:34 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  Re: [TN] PCB baking conditions


YH,

You really want to bake out boards above the boiling point of water (100C)
to drive out the moisture, but below the glass transition temperature
(about
140C for FR4) to avoid cross linking of the PCB epoxy.  I really think that
the 125C range is where you should be, perhaps for 4-5 hours.

Steve A
> -----Original Message-----
> From: Yu-Hung Shiau [SMTP:[log in to unmask]]
> Sent: Wednesday,October 03,2001 5:25 PM
> To:   [log in to unmask]
> Subject:      [TN] PCB baking conditions
>
> Hi,
> * Is anybody sure about the temperatre and time for baking the bare PCBs
> that were humidified by condensed moisture to prevent SMT problems?
> * Is 120F for 2 hrs appropriate?
> Thank you for any input.
> YH Shiau
>
>
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> ----------
> From:         Flatfield, Cadcam[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Friday, October 05, 2001 3:52 AM
> To:   [log in to unmask]
> Subject:      Delamination testing.
> Importance:   High
>
> Hello all,
>
> Maybe this is a strange question but there are very much absoletb
> components
> to be placed on the boards.
>
> I like to know if there is a test method on testing MLB boards for
> delamination.
>
> I have been thincking about placing the boards into a oven for a while
> before soldering the boards. What time should i use in the oven and at
> what
> temperature to be sure there will be no delamination.
>
> The soldermethode for these boards is 2 x reflow an 1 x wave.
>
> Best regards,
>
> Gerard Goossens
> Flatfield multi print
> Tel  :+31-344-622556
> Fax :+31-344 613652
>
> -----------------------------------
> Mail  : [log in to unmask]
> Website : www.flatfield.nl
> -----------------------------------
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