Don't know how I got posted twice. No matter, forgot to address thermal.

Based on the dual postings, it is obvious CIC can do TCE but it also can do
thermal whether constraining thick core of thin tailoring core but why go to
all that fuss?

If Steve will indulge again, I did a 10 oz Cu internal thermal relief core
at about the same time as all the CIC stuff. The 10 oz core could be two 5
oz cores as well.

One picture shows a 10 oz copper plain sandwiched between two, three, or
four layer MLB's much as with the CIC. The other picture shows a finished
MLB with "rails" on either side of the board with holes drilled into the
rails. They acted as heat pipes to a cold wall connection for thermal relief
using liquid cooling. Some of you might remember this application used in
VLSI test
equipment at the time.

The lamination trick with the 10 oz stuff was, of course, to use very high
resin content preg so it would fill around and through the Cu and its holes.

MoonMan

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