To improve our wetting, we had to raise the temperature at a steeper rate,
to a higher peak.  We were using an Omniflo-5 w/o N2.  We created a
ramp-spike type of profile with the peak temperature measured at 230°C.  The
wetting improved.  The joints will never represent the text book definition
of a good joint.  Ours were results generally good.


Richard Elensky
Sr. Manufacturing Engineer
[log in to unmask] <mailto:[log in to unmask]> 

Tel:  559-292-1111  x246
Fax:  559-292-9355

Dantel
2991 North Argyle Ave.
Fresno, CA, 93727
Visit our web site at:
http:// www.dantel.com <http://www.dantel.com> 


        ----------
        From:  Kevin Stokes [SMTP:[log in to unmask]]
        Sent:  Thursday, October 04, 2001 1:43 PM
        To:  [log in to unmask]
        Subject:  [TN] Palladium solderability problems

        Everyone, 

        We are recently having some issues with a G sensor getting adequate
solderability to the palladium leads. 

        We have looked at the reflow profiles and temps and times look good.


        Any ideas what I should look at next to get a grip on this problem? 

        As always, your help is appreciated. 

        Kevin 

        Kevin Stokes 
        Reliability Manager 
        Kimball Electronics Group 
        (812) 634-4207 
	

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