http://www.isolalaminatesystems.com/technical/techbulletins/index.htm
This is a web site at isola laminates that has a tech paper addressing board baking.





Steve Abrahamson <[log in to unmask]>@IPC.ORG> on 10/04/2001 09:53:34 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  Re: [TN] PCB baking conditions


YH,

You really want to bake out boards above the boiling point of water (100C)
to drive out the moisture, but below the glass transition temperature
(about
140C for FR4) to avoid cross linking of the PCB epoxy.  I really think that
the 125C range is where you should be, perhaps for 4-5 hours.

Steve A
> -----Original Message-----
> From: Yu-Hung Shiau [SMTP:[log in to unmask]]
> Sent: Wednesday,October 03,2001 5:25 PM
> To:   [log in to unmask]
> Subject:      [TN] PCB baking conditions
>
> Hi,
> * Is anybody sure about the temperatre and time for baking the bare PCBs
> that were humidified by condensed moisture to prevent SMT problems?
> * Is 120F for 2 hrs appropriate?
> Thank you for any input.
> YH Shiau
>
>
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