Thermal profile information is difficult to include on individual component
data sheets, as it depends on the solder you're going to use and the
thermal mass of other components around it on the board assembly.
Has a stone been set rolling down a mossy hill with this thread?
Pter Duncan
Kathy Kuhlow
<Kathy@BTW-IN To: [log in to unmask]
C.COM> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
Sent by: Aero/ST Group)
TechNet Subject: Re: [TN] Land Patterns
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ORG>
10/30/01
11:24 PM
Please
respond to
"TechNet
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Forum."
Could you add thermal profile information to the request list?
Kathy
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