Two original advantages as I recall.
Lower surface tension.
A degree of protection for components that contain nobel metal.
Mel Parrish
Soldering Technology International
Madison, AL
256 705 5530
256 705 5538 Fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Alan Kreplick
Sent: Wednesday, October 03, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Sn62 vs. Sn63
Hello Technet:
We're currently using a water-soluble Sn62 solder paste, in which the
formulation is five plus years old. We're beginning a solder paste
evaluation using the current solder paste, a newer formulation from that
manufacturer plus a half dozen other solder pastes from other leading paste
manufacturers.
Many of the paste manufacturers have asked why we're using Sn62, and we're
now asking ourselves the same question, "Why not make the switch to Sn63
during the paste evaluation?".
So, two questions:
What are the major Pro's & Con's of Sn62 vs. Sn63 (mechanical,
electrical, processing, etc.)?
Anybody willing to share their solder paste evaluation/qualification
(techniques, results, lessons learned, etc.)
As, always, thanks in advance for your responses.
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
North Reading, MA
Tel: 978-370-1726
Fax: 734-661-5352
----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|