For a 0.040" substrate, start with .018" pulse depth and .006" laser pulse
spacing. This is a reference point only and should be adjusted to meet your
specific needs.
Check out Coorstek, www.coorstek.com. They have alot of good info on their
website.
--------------------------------
Scott Buscomb
PCB Design Engineer
Zight Corporation (formerly Colorado MicroDisplay Inc.)
1688 Conestoga St.
Boulder, CO 80301
720 562-0609 (direct)
> 720-562-0793 (fax)
[log in to unmask]
www.zight.com



Date:    Thu, 4 Oct 2001 10:23:08 -0500
From:    Brian Lukas <[log in to unmask]>
Subject: Ceramic Substrate

Currently I'm working with a supplier of ours that is having quality issues
in snapping there alumina substrates lending to excessive chipping and
microcracking. I would like to know what the standard is in the industry
for scoring, snapping and chipping of .040" alumina substrates. Currently
there item is a 2-up substrate that is laser scored. Due to the excessive
chipping we are seeing random field return failures due to microcracking of
the substrate. Any insight or help would be greatly appreciated.

------------------------------

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