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September 2001

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 10 Sep 2001 06:57:34 -0400
Content-Type:
text/plain
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text/plain (174 lines)
Ryan, not sure how much the capped vias increase cost.  As far as
reliability, though, we've been using this design for many years in a
military avionics environment with good results.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Ryan Grant [SMTP:[log in to unmask]]
        Sent:   Friday, September 07, 2001 11:25 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] Cap-plate Via-in-Pad??

        Jim,

        How has the cap plate filled via been working out on the production
line,
        in terms or cost and reliability.  We have had some customers
inquire about
        the technology, but I don't have first hand knowledge.

        Kind Regards

        Ryan Grant
        Advanced Technology Engineer
        MCMS
        (208) 898-1145
        [log in to unmask]


        > -----Original Message-----
        > From: Marsico, James [SMTP:[log in to unmask]]
        > Sent: Tuesday, September 04, 2001 9:01 AM
        > To:   [log in to unmask]
        > Subject:      Re: [TN] Cap-plate Via-in-Pad??
        >
        > This was probably referring to a filled via that was copper plated
over
        > the
        > top, resulting in what appears like a round, solid pad.  We use
this
        > design
        > quite often.
        >
        > Jim Marsico
        > Senior Engineer
        > Production Engineering
        > EDO Electronics Systems Group
        > [log in to unmask] <mailto:[log in to unmask]>
        > 631-595-5879
        >
        >
        >
        >         -----Original Message-----
        >         From:   Rick Thompson
[SMTP:[log in to unmask]]
        >         Sent:   Tuesday, September 04, 2001 10:40 AM
        >         To:     [log in to unmask]
        >         Subject:        [TN] Cap-plate Via-in-Pad??
        >
        >         Hi,
        >
        >         I was doing some reading over the weekend and came across
a
        > reference I
        >         wasn't familiar with that said:
        >            "Note that a filled and cap-plate via-in-pad
construction was
        > used".
        >
        >         Can someone enlighten me as to what 'filled and cap-plate
        > via-in-pad' is?
        >
        >         Thanks,
        >
        >
        >         Rick Thompson
        >         Ventura Electronics Assembly
        >         2655 Park Center Dr.
        >         Simi Valley, CA 93065
        >
        >         +1 (805) 584-9858   x-304  voice
        >         +1 (805) 584-1529 fax
        >         [log in to unmask]
        >
        >
        >
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