Jim,

How has the cap plate filled via been working out on the production line,
in terms or cost and reliability.  We have had some customers inquire about
the technology, but I don't have first hand knowledge.

Kind Regards

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: Marsico, James [SMTP:[log in to unmask]]
> Sent: Tuesday, September 04, 2001 9:01 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Cap-plate Via-in-Pad??
>
> This was probably referring to a filled via that was copper plated over
> the
> top, resulting in what appears like a round, solid pad.  We use this
> design
> quite often.
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
>
>
>         -----Original Message-----
>         From:   Rick Thompson [SMTP:[log in to unmask]]
>         Sent:   Tuesday, September 04, 2001 10:40 AM
>         To:     [log in to unmask]
>         Subject:        [TN] Cap-plate Via-in-Pad??
>
>         Hi,
>
>         I was doing some reading over the weekend and came across a
> reference I
>         wasn't familiar with that said:
>            "Note that a filled and cap-plate via-in-pad construction was
> used".
>
>         Can someone enlighten me as to what 'filled and cap-plate
> via-in-pad' is?
>
>         Thanks,
>
>
>         Rick Thompson
>         Ventura Electronics Assembly
>         2655 Park Center Dr.
>         Simi Valley, CA 93065
>
>         +1 (805) 584-9858   x-304  voice
>         +1 (805) 584-1529 fax
>         [log in to unmask]
>
>
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