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Subject:	Inc. The committee meeting began
From:	½ðºè <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Sat, 1 Sep 2001 04:48:10 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (12 lines)

I for the IPC-6012A.  This document will be distributed to the subcommittee for a fast track to publication.  Aspects of the amendment requiring further exploration were deferred to a subsequent revision of the standard.  There was much discussion on the subject of elongation for testing for additive/electroless copper platings.  It was recommended that the minimum percentage be extended from 6% to 12%.  This will be incorporated into the draft for the next revision of IPC-6012 for industry review.

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