Hello Technetters,

I have a client who is building boards internally (pretty rare, eh?).
Anyway, they are using 1970's technology and they would like to upgrade
their equipment. Switch to to dry film, water based chemicals. No multi
layers, or plated through holes at this time. 12" x 12" capability desired.
They build about 34,000 boards a month.

Their current process is listed at the bottom of this email. Their problem
is finding vendors willing to deal with their small volume. If you are
interested in selling them equipment or consumables, please contact me
offline.

Thanks,
Craig


1. PRE COAT VARIOUS COPPER CLAD LAMINATES WITH LIQUID SOLVENT PHOTO RESIST.
KPR 3

 2. IMAGE THE PRE-COATED COPPER LAMINATE BY EXPOSING THE PANEL TO UV LIGHT,
MASKING OFF THE AREAS TO BE EXPOSED WITH A NEGATIVE, OR POSITIVE CLEAR AND
BLACK  PHOTO TOOL.

3. IMMERSE PANEL IN THE DEVELOPING SOLUTION.  WHICH DISOLVES THE UNHARDENED
PHOTO RESIST. WE USE A SOLVENT BLEND XYLENE

4. ETCH THE PANEL USING FERRIC CHLORIDE SOLUTION TO REMOVE THE UNWANTED
COPPER AWAY FROM THE CIRCUIT.

5. STRIP THE REMAINING PHOTO RESIST OFF THE  PANEL.   KPR STRIPPING SOLUTION



Dr. Craig Hillman
Director, Laboratory Services
CALCE Electronic Products and Systems Center
Building 89, Room 1103
University of Maryland
College Park, MD 20742
301-405-5316
413-581-337 (fax)
[log in to unmask]

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