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September 2001

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Subject:
From:
Jim Kittel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Sep 2001 06:48:35 -0600
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Bill,
If you have not already, look at the cooling rate on your reflow oven.  I
solved a similar similar warpage problem by reducing the solder cooling rate
to 1 deg C/second.  I had to modify the blowers in the cool down section to
achieve that rate.  I found my oven was designed to blast the top of the BGA
with cold air while the solder was still liquidus.  It provided for high
speed production, but was warping some of the BGA's.

Jim Kittel

-----Original Message-----
From: Bill Raymond [mailto:[log in to unmask]]
Sent: Thursday, September 06, 2001 6:16 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Warp


Werner, thanks for your comments.  We are stuck with a single source for
this BGA... no one else makes it.  Looks like my best bet is to try to talk
to the "right" person at the BGA manufacturer.

Bill...

At 03:56 AM 09/06/2001 -0400, you wrote:
>Hi Bill,
>BGA warpage is the consequence of an asymmetric [=bad] design. My
>recommendation, get somebody else's BGA.
>Werner Engelmaier

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