Steve - The immersion tin deposits are still in work - to date one deposit
is till soldering like a champ after 500 days both storage conditions. The
latest tin to be added to the test is at day 308, still going strong.
Regards
-----Original Message-----
From: Steve Kelly [SMTP:[log in to unmask]]
Sent: Thursday, September 27, 2001 5:39 PM
To: [log in to unmask]
Subject: Re: [TN] Circuit Coatings Shelf Life
Excellent data - do you have anything similar for immersion tin. Thanks
Steve Kelly
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gerard O'Brien
Sent: Thursday, September 27, 2001 4:47 PM
To: [log in to unmask]
Subject: Re: [TN] Circuit Coatings Shelf Life
Ken, can not give times for those conditions, however I have presented a
vast quantity of wetting balance data to the J-Std 003 committee on testing
those finishes in real time, open on a shelf in both environmentally
controlled storage as well as in a chemical storage shed. To cut to the
chase , I ran out of test coupons for HASL after 800 plus days of
continuous testing. Reduction in wetting force day one to day 800 was
approximately 22 to 25%, storage location dependant. For Enig, ran out of
coupons after 887 days, reduction in wetting force 33%, independent of
storage location. OSP, ran out of coupons after 600 plus days (guess I
thought it wouldn't last or something), reduction in wetting force 20 to
22% depending on storage location. Wetting times remained well below 1
second even after all this time. The time to reach max wetting force really
only increased significantly for ENIG due to passivation of the nickel
surface. All tests were performed using a type ROL0 flux as per j-std-004.
The FR4 coupons were dipped 90 degrees to the solder pot in a classic edge
dip wetting balance test. Buoyancy from the coupon is dealt with by the
software for the wetting balance. If you store these finishes as you
outline they should out perform my "worst case" conditions.
Regards
Gerard O'Brien.
Photocircuits corp.
-----Original Message-----
From: Ken Hafften [SMTP:[log in to unmask]]
Sent: Thursday, September 27, 2001 3:07 PM
To: [log in to unmask]
Subject: [TN] Circuit Coatings Shelf Life
I am looking for the comparative shelf life for HASL, OSP, and ENIG at the
following circuit board storage conditions:
Taped bag (less than 70F and 50% RH)
Vac-pak (less than 70F and 50% RH)
Taped bag (greater than 70F, 60% RH)
Vac-pak (greater than 70F, 60% RH)
Thanks in advance for any help on this question.
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