Tim,

We're often asked to stack chip components and perform other odd
modifications. We have also added a new procedure to IPC 7721 called
Component Modifications and Additions. You can preview our version of this
procedure, including images of stacked components, on our web site at:
http://www.circuittechctr.com/guides/6-3.htm

Jeff Ferry, CEO

Circuit Technology Center, Inc.

Chairman

IPC Repairability Committee

On Wed, 26 Sep 2001 09:10:38 -0500, Tim Devaul <[log in to unmask]>
wrote:

>Good morning,
>
>     I am in the middle of a slight disagreement between a couple of our
company's organizations. It is over stacking
>SMD chips, specifically 0603s. In a temporary rework fix engineering wants
to stack and solder one chip directly on top of the other. Does anyone have
any experience positive or negative concerning this practice?
>
>Tim DeVaul
>Quality Assurance Training and Audit Supervisor
>Philips Broadband Networks, Inc.
>100 Fairgrounds Dr.
>Manlius, New York 13104
>Tel: (315) 682-9105 Ext. 2403
>Fax: (315)682-9006
>Email: [log in to unmask]
>
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